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TVS Diode Array For ESD and Latch-Up Protection
PROTECTION PRODUCTS Description
The SMF series TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD and other voltage-induced transient events. They are designed for use in applications where board space is at a premium. Each device will protect up to four lines. They are unidirectional devices and may be used on lines where the signal polarities are above ground. TVS diodes are solid-state devices designed specifically for transient suppression. They feature large cross-sectional area junctions for conducting high transient currents. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The SMF series devices may be used to meet the immunity requirements of IEC 61000-4-2, level 4. The small SC70 package makes them ideal for use in portable electronics such as cell phones, PDA's, notebook computers, and digital cameras.
SMF05 and SMF12
Features
Transient protection for data lines to IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) Small package for use in portable electronics Protects four I/O lines Working voltage: 5V and 12V Low leakage current Low operating and clamping voltages Solid-state silicon-avalanche technology
Mechanical Characteristics
EIAJ SC70-5L package Molding compound flammability rating: UL 94V-0 Marking : Marking Code Packaging : Tape and Reel
Applications
Cellular Handsets and Accessories Cordless Phones Personal Digital Assistants (PDA's) Notebooks & Handhelds Portable Instrumentation Digital Cameras Peripherals MP3 Players
Circuit Diagram
1 3 4 5
Schematic & PIN Configuration
1 2 3
5
4
2
SC70-5L (Top View)
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SMF05 and SMF12
PROTECTION PRODUCTS Absolute Maximum Rating
Rating Peak Pulse Power (tp = 8/20s) Peak Forward Voltage (IF = 1A, tp=8/20s) ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) Lead Soldering Temperature Operating Temperature Storage Temperature Symbol Ppk VFP VESD TL TJ TSTG Value 200 1.5 20 15 260 (10 seconds) -55 to +125 -55 to +150 Units Watts V kV
o
C C C
o
o
Electrical Characteristics
SMF05 Par ame te r Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Peak Pulse Current Junction Cap acitance Symbo l VRWM V BR IR VC VC IP P Cj It = 1mA VRWM = 5V, T=25C IPP = 1A, tp = 8/20 s IPP = 12A, tp = 8/20 s tp = 8/20 s Between I/O p ins and Ground VR = 0V, f = 1MHz 150 6 10 9.5 12.5 12 175 Co nditio ns Minimum Typical Maximum 5 Units V V A V V A pF
SMF12 Par ame te r Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Peak Pulse Current Junction Cap acitance Symbo l VRWM V BR IR VC VC IP P Cj It = 1mA VRWM = 12V, T=25C IPP = 1A, tp = 8/20 s IPP = 8A, tp = 8/20 s tp = 8/20 s Between I/O p ins and Ground VR = 0V, f = 1MHz
2
Co nditio ns
Minimum
Typical
Maximum 12
Units V V
13.3 1 19 25 8 60 75
A V V A pF
2008 Semtech Corp.
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SMF05 and SMF12
PROTECTION PRODUCTS Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
10 Peak Pulse Power - Ppk (kW)
Power Derating Curve
110 100 90 % of Rated Power or IPP 80 70 60 50 40 30 20 10
1
0.1
0.01 0.1 1 10 Pulse Duration - tp (s) 100 1000
0 0 25 50 75 100
o
125
150
Ambient Temperature - TA ( C)
Pulse Waveform
110 100 90 80 Percent of IPP 70 60 50 40 30 20 10 0 0 5 10 15 Time (s) 20 25 30 td = IPP/2 e
-t
Clamping Voltage vs. Peak Pulse Current
30 Waveform Parameters: tr = 8s td = 20s 25 20 SMF12 15 10 5 0 0 2 4 6 8 10 12 14 Peak Pulse Current - IPP (A) Waveform Parameters: tr = 8s td = 20s SMF05
Clamping Voltage - VC (V)
Capacitance vs. Reverse Voltage
160 140 Capacitance - Cj (pF) 120 100 80 60 40 20 f = 1MHz 0 0 1 2 3 4 5 6 Reverse Voltage - VR (V) SMF05
SMF05 Insertion Loss S21
CH1 S21 LOG 6 dB / REF 0 dB
START . 030 MHz
. STOP 3000 000000 MHz
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SMF05 and SMF12
PROTECTION PRODUCTS Typical Characteristics (Continued)
SMF05 ESD Clamping (8kV Contact per IEC 61000-4-2) SMF12 ESD Clamping (8kV Contact per IEC 61000-4-2)
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SMF05 and SMF12
PROTECTION PRODUCTS Applications Information
Device Connection for Protection of Four Data Lines The SMFxx is designed to protect up to four unidirectional data lines. The device is connected as follows: 1. Unidirectional protection of four I/O lines is achieved by connecting pins 1, 3, 4, and 5 to the data lines. Pin 2 is connected to ground. The ground connection should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: Place the SMFxx near the input terminals or connectors to restrict transient coupling. Minimize the path length between the SMFxx and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. SMF Circuit Diagram
1
3
4
5
2
Protection of Four Unidirectional Lines
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SMF05 and SMF12
PROTECTION PRODUCTS Typical Applications
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SMF05 and SMF12
PROTECTION PRODUCTS Outline Drawing - SC70 5L
A e1 N 2X E/2 EI E GAGE PLANE 0.15 L (L1) e B D aaa C SEATING PLANE A2 A SIDE VIEW C A1 bxN bbb C A-B D DETAIL c D H
DIM
A A1 A2 b c D E1 E e e1 L L1 N 01 aaa bbb ccc
DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX
.043 .000 .004 .028 .035 .039 .006 .012 .003 .009 .075 .079 .083 .045 .049 .053 .083 BSC .026 BSC .051 .010 .014 .018 (.017) 5 0 8 .004 .004 .012 1.10 0.00 0.10 0.70 0.90 1.00 0.15 0.30 0.08 0.22 1.90 2.00 2.10 1.15 1.25 1.35 2.10 BSC 0.65 BSC 1.30 BSC 0.26 0.36 0.46 (0.42) 5 0 8 0.10 0.10 0.30
01
ccc C 2X N/2 TIPS
1
2
A
SEE DETAIL
A
NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENCE JEDEC STD MO-203, VARIATION AA.
Land Pattern - SC70 5L
X
DIM
C Y P G Z C G P X Y Z
DIMENSIONS MILLIMETERS INCHES
(.073) .039 .026 .016 .033 .106 (1.85) 1.00 0.65 0.40 0.85 2.70
NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2008 Semtech Corp.
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SMF05 and SMF12
PROTECTION PRODUCTS Marking Codes
Part Number SMF05 SMF12 Marking Code F05 F12
Ordering Information
Part Number SMF05.TC SMF12.TC SMF05.TCT SMF12.TCT Lead Finish SnPb SnPb Pb free Pb free Qty per R eel 3,000 3,000 3,000 3,000 R eel Size 7 Inch 7 Inch 7 Inch 7 Inch
Contact Information
Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804
www.semtech.com
2008 Semtech Corp.
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